• Superluminescent diodes for optical coherence tomography (SD-OCT) - Inphenix

    https://www.inphenix.com/en/superluminescent-diode-devices/

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    SLD is a #semiconductoropticalamplifier with no input signal, where weak spontaneous emission into the waveguide mode is followed by strong laser amplification.
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  • Swept Source Laser at Inphenix Inc.

    https://www.inphenix.com/en/swept-source-laser/

    Inphenix’s swept source laser offers deep penetration, long coherence length and high resolution.

    Based on Inphenix’s leading #Semiconductor Optical Amplifier (SOA) technology, swept source is specifically designed for #SweptSource Optical Coherence Tomography (SS-OCT) and Optical Frequency Domain Reflectometry (OFDR) applications.
    Swept Source Laser at Inphenix Inc. https://www.inphenix.com/en/swept-source-laser/ Inphenix’s swept source laser offers deep penetration, long coherence length and high resolution. Based on Inphenix’s leading #Semiconductor Optical Amplifier (SOA) technology, swept source is specifically designed for #SweptSource Optical Coherence Tomography (SS-OCT) and Optical Frequency Domain Reflectometry (OFDR) applications.
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  • A Superluminescent diode (SLD) at Inphenix Inc

    https://www.inphenix.com/en/superluminescent-diode-devices/

    A #superluminescentdiode is one type of edge-emitting semiconductor light source that emits low coherence but high brightness light.

    Mainly, Superluminescent diodes are applied in smooth and high intensity broadband optical spectrum. They don't have built-in optical feedback mechanism.

    #SLD provides amplified spontaneous emission and can be efficiently coupled into a single-mode fibre.
    A Superluminescent diode (SLD) at Inphenix Inc https://www.inphenix.com/en/superluminescent-diode-devices/ A #superluminescentdiode is one type of edge-emitting semiconductor light source that emits low coherence but high brightness light. Mainly, Superluminescent diodes are applied in smooth and high intensity broadband optical spectrum. They don't have built-in optical feedback mechanism. #SLD provides amplified spontaneous emission and can be efficiently coupled into a single-mode fibre.
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  • Semiconductor IP Market Leading Segment, Demand and Growth Analysis Over 2023

    The market for Semiconductor IP market is estimated to grow at a significant rate during the forecast period 2018 to 2023. The geographical analysis of semiconductor intellectual property (IP) is studied for North America (U.S, Canada, and Mexico), Europe (Germany, U.K, France, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea and Rest of Asia-Pacifc), and the Rest Of The World (including the Middle East & Africa, and South America).

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    Semiconductor IP Market Leading Segment, Demand and Growth Analysis Over 2023 The market for Semiconductor IP market is estimated to grow at a significant rate during the forecast period 2018 to 2023. The geographical analysis of semiconductor intellectual property (IP) is studied for North America (U.S, Canada, and Mexico), Europe (Germany, U.K, France, Russia, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea and Rest of Asia-Pacifc), and the Rest Of The World (including the Middle East & Africa, and South America). Get Free Sample Report @ https://www.marketresearchfuture.com/sample_request/7277
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    Semiconductor IP Market estimated to reach USD 2-3 billion by 2027, Semiconductor IP Market growing with 14% CAGR by Forecast 2027 | semiconductor IP Industry
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  • Semiconductor Assembly and Testing Service Market is Likely to Deliver Dynamic Progression by 2022

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  • 3D mapping & 3D Modelling Market is Likely to Increase at a Significantly High CAGR by 2023

    The prominent players in Chip scale package LED market are Lumileds Holding B.V. (US), Samsung Electronics Co., Ltd. (South Korea), Semiconductor Co., Ltd. (South Korea), OSRAM Opto Semiconductors GmbH (Germany), LG Innotek (South Korea), Epistar Corp. (Taiwan), Cree, Inc. (US), Genesis Photonics Inc. (Taiwan), Semileds Corporation (Taiwan), and Lextar Electronics Corporation (Taiwan).

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    Chip Scale Package LED Market Research Report - Forecast to 2027 | MRFR
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  • #BeverageProcessingEquipmentMarket
    Beverage Processing Equipment Market Research Report

    Beverage processing equipment are the system, tools, and processing machines used to prepare, store, and pack the beverage products. They are used to modify raw agricultural commodities and semi-processed products into extensive beverage items for further processing. The processing involves various steps which include preparation, fermentation, and blending of the liquid.

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    #BeverageProcessingEquipmentMarket Beverage Processing Equipment Market Research Report Beverage processing equipment are the system, tools, and processing machines used to prepare, store, and pack the beverage products. They are used to modify raw agricultural commodities and semi-processed products into extensive beverage items for further processing. The processing involves various steps which include preparation, fermentation, and blending of the liquid. For additional insights, click to access: https://www.launchora.com/story/beverage-processing-equipment-market-research-repo
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  • VCSEL (Vertical Cavity Surface Emitting Laser) - Inphenix Inc.

    https://www.inphenix.com/en/vertical-cavity-surface-emitting-laser-vcsel/

    A VCSEL (vertical cavity surface emitting laser) is a surface-emitting #semiconductor light source which emits laser beams in a direction perpendicular to it’s top surface.

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  • 3D Integrated Circuit Market Estimated to Flourish at by 2022

    The rise in demand by semiconductor industry for high density and bandwidth, and low power solution, many IC designers are looking up for 3D ICs mounted with through silicon vias (TSVs). 3D ICs accommodate with multiple heterogeneous die such as logic, memory, analog, RF, and micro-electrical mechanical systems thereby improve performance and reduce cost. 3D ICs offers following advantages over traditional system on chips (SoC): low cost, easier to meet high interconnect speeds & bandwidth requirements, ideal for compact mobile devices, reduced resistance-inductance-capacitance helps in reducing power, emerging technologies such as MEMS can potentially be integrated into 3D stacks. 3D ICs with TSVs is showing huge opportunity for semiconductor industry. It offers compelling power, performance and form factor advantages and also can curb the escalating cost of SoC development. However, a well-defined ecosystem including foundries, IP providers, and vendors, need to emerge with more innovative design kits and reference flows

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